AWG G3 PAD FOR PS3 Spécifications télécharger pdf (Page 117)

Signal Traces 5 DUT Board Performance Considerations

System Reference, January 2001

117

with higher pin count. Without these dummy pads, the

pogo pins of the DUT interface may damage the unpro-

tected DUT board over time.

Typical pad size is 1.6 to 1.8 mm, hole diameter is 0.7 mm.

Landing Holes We recommend to use pogo landing holes (plated through

holes) instead of plane pads for better contact quality. A

landing hole provides a 3-point signal contact, whereas a

plane pad has a single contact point only. Over time, abra-

sion will reduce the contact quality, with a plane pad this

is much more critical than with a landing hole. Don’t use

blind vias either, as their contact quality is inferior to pogo

landing holes.

Unused tester channels may have pads without holes.

DPS Lines For information of DPS line layout, refer to “Routing DPS

Lines” on page 163.

Keep-out Areas

Care must be taken when putting traces on the board’s

outer side. In handler applications, the board is close to

the metal of the handler and could inductively couple if

not short out. Only low-speed traces should be placed on

the board’s outer sides, even with the additional isolation

sheet.

• No traces or components are allowed on the bottom/

tester side of the board (except within an area of

120×120 mm).

• Traces are allowed on the top/DUT side of the board

(except landing pad and mechanical hole areas).

• The stiffener will lie flush against the bottom surface of

the PCB at every point except the landing pad areas.

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AWG G3 PAD FOR PS3 Spécifications Page 117