AWG G3 PAD FOR PS3 Spécifications Page 75
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- Table des matières
- MARQUE LIVRES
Noté. / 5. Basé sur avis des utilisateurs
Test System Configuration 4 Test Head Filling and DUT Board Considerations
System Reference, January 2001
75
The unshaded (white) groups in Figure 37 can contain
analog modules only. The shaded (dark grey) groups can
only contain digital boards.
There is a filling algorithm for filling the test head with
digital boards and analog modules:
• Digital Filling:
Group 1 ---> Group 3
• Analog Filling:
Group 8 ---> Group 2
This system configuration has a maximum analog and a
maximum digital configuration:
• Maximum Analog:
16 analog modules ---> 256 digital pins
• Maximum Digital:
The same as above.
The main advantage of the analog dominant configura-
tion of the 512 pin SOC series tester is that up to 16
analog modules can be supported.
- System Reference 1
- Objectives of this Manual 3
- Audience 3
- Scope of the Manual 3
- Safety Information 4
- 2 System Startup 31 6
- 3 Hardware Components 37 6
- 6 Device PowerSupply 135 7
- 7 Analog Modules 183 8
- A XICOR EEPROM Summary 267 9
- Index 269 9
- Table of Contents 10
- List Of Figures 11
- System Overview 15
- Revision History 16
- System Characterization 18
- Technical Highlights 20
- AC/DC Converters 21
- (in support rack) 21
- Major Components 23
- (as shown here) 24
- DUT Interface 25
- The Manipulator 26
- ON/OFF Unit 27
- The Cooling System 28
- The Workstation 29
- System Startup 31
- Emergency OFF 32
- Standby (red) 32
- ON (green) 32
- Running the System Software 34
- Emergency Off 36
- Hardware Components 37
- Tester Electronics 38
- 128 pins 39
- DPS Channel 1 40
- DPS Channel 2 40
- DPS Channel 3 40
- DPS Channel 4 40
- Channel Board 42
- Master Clock Generator 43
- ReferenceVoltage 43
- Generator 43
- High Precision PMU 43
- Parametric Measurement Units 45
- Pin PMU Settling Time 46
- Time for converting a 46
- High-Precision PMU 47
- Master Clock System 49
- 512-Pin Testhead 53
- Analog Clock Domain 54
- Overview of Test Heads 59
- Structure of Card Cages 60
- DUT Board Mechanical 61
- Overview of DUT Board Options 62
- Allocation of Card Cages 63
- Pad Blocks 67
- Testhead 69
- Test System Configuration 70
- Analog Dominant Configuration 74
- Overview of Filling 78
- Digital Fill Order 79
- (under investigation) 80
- Analog Fill Order 81
- DPS-Type Fill Order 86
- Pogo Pad Assignment 88
- Analog Pogo Pad Location 89
- Orientation Marker 95
- on Housing 95
- Utility, EEPROM and HPMU 97
- Possible Positions 102
- for the EEPROM 102
- Wafer Prober DUT Board and 104
- Probe Card 104
- DUT Board of Wafer Prober 105
- Seg. = Segment 107
- (Group) No. in 113
- DUT Board Performance 115
- Considerations 115
- Signal Traces 116
- Keep-out Areas 117
- Maintaining Signal Fidelity 118
- Signal Inhomogeneities 119
- Correctly Terminating Signal 120
- Terminating Output Pins 121
- Termination Checklist 122
- Reducing I/O Round-Trip Times 123
- DUT Board Design for Mixed 124
- Signal Tests 124
- Analog Ground 126
- (Ground Plane) 126
- Digital Ground 126
- Printed Circuit Board 129
- Sharp Corner 131
- Rounded Corner 131
- Device PowerSupply 135
- General Purpose Power Supply 136
- Switching DPS Voltages 138
- Ganged GPDPS Channels 138
- GPDPS Specifications 139
- Supply Voltage 140
- Supply Current 140
- Setting up Performance Ranges 141
- 20 mA –> 0 151
- 0 –> 20 mA 151
- Decoupling Recommendations 154
- Voltage Settling Times 157
- DPS channel switching into 158
- Ganging GPDPS Channels 159
- Disconnecting the DPS 162
- Routing DPS Lines 163
- Device Operation Sequence 164
- High Current Power Supply 168
- Connection to DUT Board 169
- Block Diagram 170
- HCDPS Specifications 176
- Ganging HCDPS Boards 177
- Disconnecting the HCDPS 177
- Routing HCDPS Lines 177
- HVDPS General Description 181
- HVDPS Specifications 182
- Analog Modules 183
- Waveform Generators 184
- Downloading 185
- Controlling 185
- Outputting 185
- Output Order 185
- High Speed AWGs 189
- Output Multiplexer 190
- SYNC CLK 191
- SYNC DATA 191
- Output Amplifier 193
- Attenuator 194
- Digital-to-Analog Converter 194
- Timing Generator 194
- Sequencer and Waveform Memory 195
- Front-end Module 196
- Attenuator/ 197
- AWG Instrument 201
- Waveform Digitizers 203
- Synchronization trigger 204
- Digitizing then memorizing 204
- Sampling Period 204
- Initial Discard 204
- Analog Out 205
- Synchronization 205
- Input Multiplexer 209
- Figure 93 Input Resistance 210
- Input Amplifier 214
- Analog-to-Digital Converter 214
- Sampler Overview 216
- Theory of Operation 219
- DC offset 221
- Time Interval Analyzer 225
- Single Channel 226
- Dual Channel 226
- TrigDelayCnt 228
- PW+(PW ) 228
- PD++ (PD +, PD+ ,PD ) 229
- TIA Key Specifications 233
- Input Block 238
- TIA Instrument 240
- ± the fixed 243
- Trigger signal 244
- @trigger input pin 244
- Analog module’s start timing 244
- @Analog module pin 244
- Synchronization Trigger 248
- Measurement start 249
- @DUT pin 249
- Analog signal 249
- Trigger edge setting 249
- Trigger Line, and Signal Line 250
- Synchronization Uncertainty 254
- Beginning of 258
- Tester Period 258
- Master Trigger Function 260
- Master-Slave” 261
- Appendices 265
- 266 Test Setup, January 2001 266
- XICOR EEPROM Summary 267
- NOT RECOMMENDED 268
- FOR NEW DESIGNS 268
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