AWG G3 PAD FOR PS3 Spécifications télécharger pdf (Page 25)

Major Components 1 System Overview

System Reference, January 2001

Figure 7 Agilent 93000 SOC Series Testhead

For detailed information on the tester electronics, refer to

“Tester Electronics” on page 38.

For detailed information on the analog modules, refer to

Chapter 7 “Analog Modules” on page 183.

DUT Interface The device under test (DUT) is mounted on a DUT board

which is connected to the I/O channels by the DUT inter-

face. The DUT interface consists of high performance coax

cabling and spring contact pins (pogo pins) which make

the contact to the DUT board.

For details on DUT interfaces and boards, refer to

Chapter 4 “Test Head Filling and DUT Board Consider-

ations” on page 57.

Docking The DUT interface provides docking capabilities to

handlers and wafer probers. The docking mechanism is

controlled by compressed air, but can also be operated

manually, if required.

For detailed information on DUT board docking, refer to

the Docking Hardware Reference.

DUT Interface

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AWG G3 PAD FOR PS3 Spécifications Page 25