AWG G3 PAD FOR PS3 Spécifications Page 7

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Table of Contents
System Reference, January 2001
7
DUT Board of Wafer Prober 105
Probe Card-Pogo Pad Assignment 107
5 DUT Board Performance Considerations 115
Signal Traces 116
Keep-out Areas 117
Maintaining Signal Fidelity 118
Crosstalk 118
Signal Inhomogeneities 119
Correctly Terminating Signal Lines 120
Why use Impedance Matching Techniques? 120
How Transmission Lines are Terminated 120
Terminating Output Pins 121
Terminating Bidirectional Pins 121
Termination Checklist 122
Reducing I/O Round-Trip Times 123
DUT Board Design for Mixed-Signal Tests 124
Guidelines 124
Grounding and Signal Shielding 126
Printed Circuit Board 129
Troubleshooting Noise Problems 132
6 Device PowerSupply 135
General Purpose Power Supply (GPDPS) 136
GPDPS General Description 136
GPDPS Specifications. 139
Setting up Performance Ranges 141
Decoupling Recommendations 154
Switching DPS Voltages (Vbump) 155
Ganging GPDPS Channels 159
Disconnecting the DPS 162
Routing DPS Lines 163
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